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This issue of the journal features the third part of a three‐part series which comprises Chapter 8 from Volume 1 of the recently published book ‘A Comprehensive Guide to the Manufacture of Printed Board Assemblies’ edited by W. MacLeod Ross. Volume 1, containing 800 pages, and Volume 2, scheduled to be published in the Spring of 1997 and estimated to contain around 900 pages, will, as far as the publishers are aware, be the most comprehensive book ever published on the subject of printed boards and printed board assemblies.

Specification by manufacturer's grade, restricts competition; company specifications proliferate test methods; both increase costs. BS.3888 was incompatible with foreign specifications. IEC Publication 249 promised internationally acceptable standards and led to the flexible approach to BS.4584 which allows for progressive additions to the range of test materials—now at seven—with a further seven in the foreseeable future.

This issue of the journal features the second part of a three part series which comprises Chapter 8 from Volume 1 of the recently published book ‘A Comprehensive Guide to the Manufacture of Printed Board Assemblies’** edited by W. MacLeod Ross.Volume 1, containing 800 pages, and Volume 2, scheduled to be published in the Spring of 1997 and estimated to contain around 900 pages, will, as far as the publishers are aware, be the most comprehensive book ever published on the subject of printed board assemblies.

For many years the name of W. MacLeod Ross has been familiar to manufacturers and users of printed circuits. He has been engaged in the technology of manufacture and use and has written and delivered papers on all aspects. A past Chairman of the Printed Circuit Group of the Institute of Metal Finishing, he is a Founder Member of the Institute of Circuit Technology and a Member of the Institute Council, which he represents on British Standards Institution Technical Committee ECL/19.

BS 9760 and three sectional specifications for rigid printed circuit boards have now been published. The Institute's representative on BSI Technical Committee ECL/19 outlines the new standard system and shows that it offers a good opportunity of achieving international status. The future of BS 4025, the best known British Standard for printed circuit boards, BS 4597 and the interim Defence Standards is limited. The author appeals to Institute members to support ECL/19 in its work of ensuring that the printed circuit producer and user have meaningful and cost‐effective standards.

In this paper a review is given of the more commonly employed organic polymers for coating and embedment of electronic modules. Following discussion of the basic types and their properties, problems arising from emission of volatiles from encapsulants are outlined and the importance of considering these in early design stages is stressed.

This issue of the journal features the final part of a two‐part series which comprises Chapter 15 from Volume 1 of a recently published book ‘A Comprehensive Guide to the Manufacture of Printed Board Assemblies’^* edited by W.MacLeod Ross.Volume 1, containing 800 pages, and Volume 2, scheduled to be published in the Spring of 1997 and estimated to contain around 900 pages, will, as far as the publishers are aware, be the most comprehensive book ever published on the subject of printed board assemblies.

Many potentially hazardous materials and processes are employed in the manufacture of printed circuits and printed circuit assemblies. This article draws attention to these and lists the salient properties of those most commonly employed. Methods of assisting in the assurance of the safety of personnel handling and processing these materials are suggested. It is stressed that it is important always to know exactly what is being handled and how it is being modified by process operations. Finally, suggestions are made with regard to the availability of information and assistance and the need for communication with, and education of, all personnel concerned.

This issue of the journal features the first part of a two‐part series which comprises Chapter 15 from Volume 1 of a recently published book ‘A Comprehensive Guide to the Manufacture of Printed Board Assemblies’*edited by W. MacLeod Ross. Volume 1, containing 800 pages, and Volume 2, scheduled to be published in the Spring of 1997 and estimated to contain around 900 pages, will, as far as the publishers are aware, be the most comprehensive book ever published on the subject of printed boards and printed board assemblies.

During solder usage, contamination of one kind or another is normally encountered, with subsequent alteration of solder alloy composition and behaviour.